Electroplating additives and chemicals related categories - Used for PCB plating copper oxide powder

Used for PCB plating copper oxide powder

Model Name.:Used for PCB plating copper oxide powder

  • Model No.:
  • Application: Used for PCB plating copper oxide powder
  • Patent Region:not

Product Feature:

Electronic grade PCB special copper oxide powder

Product Details:

Molecular formula: CuO Molecular weight: 79.545.
CAS No.: 1317-38-0 .

Nature and use

Copper oxide (CuO) is a black oxide of copper that is slightly amphoteric and slightly hygroscopic. The relative molecular mass is 79.545, the density is 6.36.9 g/cm3, and the melting point is 1326 °C. Insoluble in water and ethanol, soluble in acid, chlorinated and potassium cyanide solution, slowly dissolved in ammonia solution, can react with strong base.

Uses: PCB special copper oxide (CuO) is mainly used for continuous automated plating of high quality PCB, and makes the coating more uniform.

Product parameters

Copper oxide (CuO)  ≥99.3%
Iron                 (Fe)    ≤ 2.1ppm
Nickel              (Ni)    ≤ nd ppm
Lead                (Pb)   ≤ nd ppm
Chlorine          (Cl-)   ≤ 2.8ppm
Dissolution speed     ≤30S

Packing specification

Inside the PE three-layer kraft paper bag, 25KG/bag; can also be customized according to user needs.


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